HBM3 training

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HBM3 training

About Course

An HBM3 training course typically covers the fundamentals of DRAM, HBM architecture, and HBM3-specific features, including signal descriptions, channel architecture, and error handling, aiming to equip engineers with the knowledge for designing and validating systems using HBM3 technology.

 
Demo Videos

Course Videos
sl.noTopicDuration
1DDR significance in SOC, memory categories, SRAM versus DRAM, DRAM cell array01:25:37
2DDR memory organization01:12:53
3Rank, Channel, SIMM, DIMM, DDR evolution25:47
4DDR evolution23:16
5DDR frequently used terms15:04
6DDR wrapper architecture15:40
7DDR wrapper signals35:17
8Interleaved and sequential access13:47
9Need for HBM25:45
10HBM features12:07
11HBM evolution14:36
12HBM Memory Organization15:27
13Pseudo channels07:50
14IO Signal description12:27
15Microbump positions14:04
16How HBM differs from DDR06:31
17HBM channel addressing, Bank groups16:57
18Channel Addressing example23:50
19HBM4 channel addressing updates10:10
20HBM4 bank group updates02:39
21HBM4 IO signal description updates04:42
22HBM4 DRAM organization updates05:12
23HBM State diagram05:18
24HBM Initialization07:41
25Power on and controlled power off sequence02:49
26HBM mode register summary07:51
27Mode register fields13:20
28HBM4 mode register updates10:59
29Clocking overview14:07
30WDQS to CK Alignment11:38
31Data bus inversion17:31
32Commands truth table11:47
33commands RNOP Activate13:34
34Precharge20:07
35Refresh24:05
36DRFM - Directed refresh management18:25
37Refresh management15:32
38Column commands : READ22:44
39Column commands : WRITE14:36
40Column commands : MRS04:38
41Commands: PDE, PDX10:21
42Commands: SRE, SRX08:13
43HBM-Parity17:08
44Clock frequency change sequence00:56
45Interconnect redundancy remapping : DWORD remapping05:42
45Temperature Compensated refresh reporting03:27
46Interconnect redundancy remapping: AWORD remapping13:37
48Interconnect redundancy remapping: WSO remapping09:10
49Direct access test port05:15
50IEEE Standard 150034:08
51Wrapper data register types08:19
52WIR test instruction encodings11:53
53IEEE150 Bypass Extest rx tx12:33
54IEEE1500 ses5 HBM Reset05:43
55IEEE1500 MBIST03:07
56IEEE1500 soft repair11:05
57IEEE1500 hard repair03:02
58IEEE1500 DWORD MISR06:20
59IEEE1500 AWORD MISR05:39
60IEEE1500DEVICE ID, CHANNEL ID09:50
61IEEE1500 TEMPARATURE READ, LFSR COMPARE STICKY07:42
62IEEE1500 soft lane,hard lane repair08:58
63IEEE1500 channel disable and channel temparature06:54
64IEEE1500 WOSC RUN and WOSC COUNT03:12
65IEEE1500 ECS Error log05:08
66IEEE1500 HS REP CAP05:27
67IEEE1500 SELF REP and SELF REP RESULTS05:29
68IEEE1500 interaction with mission mode operation02:04
69OnDie DRAM ECC09:45
70DRAM fault isolation03:41
71ECC engine test mode07:00
72ECC transparency protocol09:46
73ECC Engine testmode12:08
74WDQS Interval Oscillator13:44
75DCA, DCM12:07
76Loopback test modes13:47
77Loopback modes features - Entering and exiting AWORD and DWORD MISR mode08:00
78AWORD and DWORD MISR mode - General features03:58
79AWORD and DWORD write parity checking, preset state for MISR registers08:28
80Loopback test modes: Summary12:01
81AWORD and DWORD Write MISR Modes07:20
82AWORD and DWORD Write register Modes10:20
83Test method for DWORD LFSR mode (Read direction)18:06
84Self repair16:01
85Self repair flow chart04:10
Curriculum

Channel Definition
Channel Addressing
Simplified State Diagram
HBM3 Power-up and Initialization Sequence
Controlled Power-off Sequence
Initialization Sequence with Stable Power
Initialization Sequence for Use of IEEE 1500 Instruction Including Lane Repairs and Channel Disable
MR0 to MR15
Master boot record sector
Partition table
Partition table entry
HBM3 Clocking Overview
WDQS-to-CK Alignment Training
HBM3 Data Bus Inversion (DBIac)
Data Bus Inversion (DBIac)
Internal DBIac State with Read Commands
Command Truth Tables
Row Commands
Row No Operation (RNOP) Command
ACTIVATE (ACT) Command
PRECHARGE (PREpb) and PRECHARGE ALL (PREab) Commands
Rounding Rules for Row Access Timings
REFRESH Command (REFab)
PER-BANK REFRESH Command (REFpb)
Refresh Management (RFM)
Adaptive Refresh Management (ARFM)
Column Commands
Column No Operation (CNOP)
Read Command (RD, RDA)
Write Command (WR, WRA)
Mode Register Set (MRS) Command
Power-Mode Commands
Power-Down (PDE, PDX)
Self Refresh (SRE, SRX)
Parity
Command/Address Parity
Data Parity
Clock Frequency Change Sequence
Temperature Compensated Refresh Reporting
Temperature Compensated Refresh Trip Points
Catastrophic Temperature Sensor
Interconnect Redundancy Remapping
AWORD Remapping
Row Command Bus – Remapping Table
Column Command Bus – Remapping Table
AWORD Remapping Examples
DWORD Remapping
DWORD Remapping Table
DWORD Remapping Example
HBM3 Loopback Test Modes
HBM3 Polynomial Structure
AWORD MISR Polynomial
DWORD MISR Polynomial
General Loopback Modes Features and Behavior
AWORD and DWORD Write MISR Modes
Test Method for AWORD (Write) MISR Mode
Test Method for DWORD Write MISR Mode
AWORD and DWORD Write Register Modes
Test Method for AWORD (Write) Register Mode
Test Method for DWORD Write Register Mode
DWORD Read Register Mode
Test Method for DWORD Read Register Mode
DWORD LFSR Mode (Read direction)
Test Method for DWORD LFSR Mode (Read direction)
AWORD and DWORD Write LFSR Compare Modes
Test method for AWORD (Write) LFSR Compare Mode
Test Method for DWORD Write LFSR Compare mode
On-die DRAM ECC
ECC Overview
HBM3 On-die ECC Requirements
DRAM Fault Isolation Requirements
Error Check and Scrub (ECS)
On-die ECC Transparency Protocol
ECC Engine Test Mode
WOSC
WDQS Interval Oscillator
tWDQS2DQ_I Offset due to Temperature and Voltage Variation
DCA and DCM
Duty Cycle Adjuster (DCA)
Duty Cycle Monitor (DCM)
Self Repair
Absolute Maximum DC Rating
Recommended DC Operating Condition
Operating Temperature
Leakage Current
Capacitance
DQ Rx Voltage and Timing
AWORD Signaling
CK and WDQS Input Signaling
Midstack Signaling
Transmit Driver Currents
Output Timing Reference Load
Output Voltage Level
Output Rise and Fall Time
Overshoot/Undershoot
IDD and IPP Specification Parameters and Test Conditions
IDD and IPP Specifications
IDD6 Specification
Signals
MicroBump Positions
HBM3 Stack Height
HBM3 Bump Map
Direct Access (DA) Test Port
DA Test Port Lockout
IEEE Standard 1500
Interaction Between DA Test Port and IEEE1500 Test Access Port
IEEE1500 Test Access Port I/O Signals
IEEE1500 Test Access Port Functional Description
Wrapper Data Register (WDR) Types
Read Only (R) Wrapper Data Registers
Write Only (W) Wrapper Data Registers
Read and Write (R/W) Wrapper Data Registers
WDR Reset State
IEEE1500 Test Access Port Instruction Encodings
Test Instructions
BYPASS
EXTEST_RX and EXTEST_TX
HBM_RESET
MBIST
SOFT_REPAIR
HARD_REPAIR
DWORD_MISR
AWORD_MISR
CHANNEL_ID
AWORD_MISR_CONFIG
DEVICE_ID
TEMPERATURE
MODE_REGISTER_DUMP_SET
READ_LFSR_COMPARE_STICKY
SOFT_LANE_REPAIR and HARD_LANE_REPAIR
CHANNEL_DISABLE
CHANNEL TEMPERATURE
WOSC_RUN and WOSC_COUNT
ECS Error Log
HS_REP_CAP
SELF_REP and SELF_REP_RESULTS
Interaction with Mission Mode Operation
IEEE1500 Test Port AC Timing Parameters
Boundary Scan

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Course Instructor
  • Sreenivas Reddy — Founder, VLSIGuru
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DFT Training FAQ

  1. Course presentations for all topics
  2. Session notes
  3. Lab documents with detailed steps
  4. User guides

Course does not have any pre-requisites. However any exposure to Digital design, VLSI design flow is an added advantage.

  • Each session of course is recorded, missed session videos will be shared

  1. Yes, You will have option to view the recorded videos of course for the sessions missed
  2. You will have option to repeat the course any time in next 1 year

  1. Yes, Course fee also includes support for doubt clarification sessions even after course completion
  2. You have option to mail you queries
  3. Option to meet in person to clarify doubts